KB Series uncooled infrared thermal imaging modules deliver high-performance thermal imaging in an ultra-compact, lightweight, and low-power package, fully meeting SWaP (Size, Weight, and Power/Price) requirements. Available in 384×288 and 640×512 resolutions with advanced 12 µm VOx detectors, these modules combine high sensitivity (NETD ≤40 mK), refined image processing algorithms, and excellent expandability.
They produce clear, detailed thermal imagery with continuous digital zoom (1–8×), multiple polarity/pseudo-color options, image mirroring, and shutter-based NUC. Flexible interfaces (CVBS/AHD analog plus BT.601/BT.656, USB 2.0, Camera Link, SDI digital) and UART control allow seamless integration into intelligent platforms. Typical power consumption is under 0.42 W (KB3) / 0.7 W (KB6) via USB, with a module size of just 21 × 21 × 26.2 mm and weight below 10–15 g (excluding lens).
Ideal for UAV EO/IR gimbals, security surveillance, outdoor thermal systems, night-vision equipment, industrial inspection, and custom secondary development. Wide operating temperature range (−40 °C to +80 °C), robust vibration/shock resistance, and optional lens driving (focus/zoom/auto-focus) make the KB Series a reliable, cost-effective core for next-generation thermal solutions.